-27%

IQhFATsvKBG0xOfz495AV4u9JfdOoejBFr2Inhi6

Thermal Cooling Paste

High quality
– Special Properties: High conductivity, Lowbleed, Stable at high temperatures
– Primary Use: Thermal coupling of electronic devices to heat sinks
– Thermal Conductivity

Apple Shopping Event

Hurry and get discounts on all Apple devices up to 20%

Sale_coupon_15

Original price was: KSh 550.00.Current price is: KSh 400.00. excl. VAT

Compare

Add to wishlist

20 People watching this product now!

Pick up from the Shop

To pick up today

Free

Courier delivery

Our courier will deliver to the specified address

1-2 Days

From 200

Rider delivery

Our rider will deliver to your address depending on location

3 hours

From 300

Warranty 1 year

More details

Free 30-Day returns

More details

Payment Methods:

Description

Thermal paste is a type of material used to fill the gap between the CPU and the heat sink, and this material is also referred to as a thermal interface material. Its function is to transfer the heat radiated by the CPU to the heat sink, keep the CPU temperature at a level that can work stably, prevent the CPU from being damaged due to poor heat dissipation, and prolong the service life.
Composed of Carbon Micro-particles it acts on electronic components, electricians, household appliances, LCDs, LEDs, CPU coolers and other products to increase heat transfer function, filling gaps, insulation, waterproof, moisture, shockproof, etc
Heatsink Compounds Thermal Paste HY510 is also Easy to Apply
Additionally has High Durability wetting the contact surface sufficiently to form a very low heat resistance surface, which is much more efficient than other heat sink products.