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Thermal Cooling Paste

High quality - Special Properties: High conductivity, Lowbleed, Stable at high temperatures - Primary Use: Thermal coupling of electronic devices to heat sinks - Thermal Conductivity

KSh 400.00 Save:KSh 150.00(27%) excl. VAT

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Description
  • Thermal paste is a type of material used to fill the gap between the CPU and the heat sink, and this material is also referred to as a thermal interface material. Its function is to transfer the heat radiated by the CPU to the heat sink, keep the CPU temperature at a level that can work stably, prevent the CPU from being damaged due to poor heat dissipation, and prolong the service life.
  • Composed of Carbon Micro-particles it acts on electronic components, electricians, household appliances, LCDs, LEDs, CPU coolers and other products to increase heat transfer function, filling gaps, insulation, waterproof, moisture, shockproof, etc
  • Heatsink Compounds Thermal Paste HY510 is also Easy to Apply
  • Additionally has High Durability wetting the contact surface sufficiently to form a very low heat resistance surface, which is much more efficient than other heat sink products.
Thermal Cooling Paste KSh 400.00 Save:KSh 150.00(27%) excl. VAT
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